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Corsair H55 Hydro Series Zero Maintenance Closed Loop Sealed CPU Water Cooler View larger

Corsair H55 Hydro Series Zero Maintenance Closed Loop Sealed CPU Water Cooler

WC-CH55

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Corsair H55 Hydro Series Zero Maintenance Closed Loop Sealed CPU Water Cooler

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Product Specifications

Corsair H55 hydro series cpu water cooling - copper , pre-filled / closed-loop / sealed coolant system , 120x152x27mm radiator , Integrated pump and reservoir is sealed for zero maintenance , radiator with 120mm fan , 1700rpm , 57CFM, 30.32dBA, 1.9mm/H2O-  for Intel LGA775/ LGA1155/LGA1156/LGA1366/LGA2011 ; AMD FM1/AM2/AM3

Product Range Features (Actual Product Features May Differ - Zaps)

The Easy CPU Performance Upgrade

Your PC will run cooler and quieter when you replace your CPU’s standard heatsink with a Hydro Series H55.

Installation is straightforward: if you can get to the back of your PC’s motherboard, you can install an H55. All you’ll need is a screwdriver.

Great for Smaller Cases

The compact components and flexible tubing make Hydro Series H55 easy to install even if you’re cramped for space. It allows you to improve your CPU’s cooling efficiency even in most compact cases — as long as your case has a 120mm fan mount near the CPU, H55 will probably fit.

Self-contained cooling system

Hydro Series H55 comes pre-filled, and never needs refilling or priming.

Tool-free mounting bracket kit

The modular design makes installation simpler, and it’s compatible with Intel and AMD processors.

Low-noise, low-speed 120mm fan

The low speed and wide diameter reduces noise levels over the smaller, faster fans used on stock CPU coolers. The three-pin connector is compatible with fan controllers.

Low permeability rubber tooling

Minimal coolant evaporation helps ensure long life, and the resilient rubber offers both high flexibility and excellent leak protection.

Low-profile pump

The pump unit provides high-speed circulation without taking a lot of space. This makes installation easier, and helps improve your case’s airflow.

Latest generation micro-fin copper cold plate with pre-applied thermal compound

Copper has excellent thermal transfer characteristics, and the fin design is optimized for efficient heat exchange.

Low-profile black aluminum heat exchanger

The low-profile design reduces the airflow requirement, which helps make H55 quieter. The small size also allows for easier installation and improved compatibility, and the black finish looks great.

Product Range Specifications (Actual Product Specifications May Differ - Zaps)

Technical Specifications

*  Radiator dimensions: 120mm x 152mm x 27mm
*  Fan dimensions: 120mm x 120mm x 25mm
*  Fan speed: 1700RPM +/- 10%
*  Fan airflow: 57 CFM
*  Fan dBA: 30.32 dBA
*  Fan static pressure: 1.9mm/H20

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