Kingston Hyper X Blu KHX1600C9aD3B1K2 4GX 2x 2Gb kit support Intel XMP ddr3 1600 FRME-K2G3X16B9x2X

Kingston Hyper-X Blu KHX1600C9aD3B1K2/4G , 2x 2Gb kit - ddr3-1600 , CL9 , 1.7-1.9v - 240pin - lifetime warranty

Product Features

Kingston's KHX1600C9AD3B1K2/4G is a kit of two 256M x 64-bit 2GB (2048MB) DDR3-1600MHz CL9 SDRAM(Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Total kit capacity is 4GB. Each module kit has been tested to run at DDR3-1600MHz at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V.

Product Specifications

JEDEC standard 1.5V ± 0.075V Power Supply

VDDQ = 1.5V ± 0.075V

667MHz fCK for 1333Mb/sec/pin

8 independent internal bank

Programmable CAS Latency: 5,6,7,8,9,10

Posted CAS

Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

Programmable CAS Write Latency(CWL) = 7(DDR3-1333)

8-bit pre-fetch

Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4

which does not allow seamless read or write [either on the fly using A12 or MRS]

Bi-directional Differential Data Strobe

Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)

On Die Termination using ODT pin

Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C

Asynchronous Reset

PCB : Height 1.180” (30.00mm), double sided component

PERFORMANCE:

CL(IDD) 9 cycles

Row Cycle Time (tRCmin) 49.5ns (min.)

Refresh to Active/Refresh Command Time (tRFCmin) 110ns

Row Active Time (tRASmin) 36ns (min.)

Power 1.800 W (operating per module)

UL Rating 94 V - 0

Operating Temperature 0o C to 85o C

Storage Temperature -55o C to +100o C